View MTN2N65J3_7663266.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 1/11 MTN2N65J3 cystek product specification n-channel enhancement mode power mosfet MTN2N65J3 features ? low on resistance ? simple drive requirement ? low gate charge ? fast switching characteristic ? pb-free lead plating and halogen-free package applications ? open framed power supply ? adapter ? stb symbol outline ordering information device package shipping MTN2N65J3-0-t3-g to-252 (pb-free lead plating an d halogen-free package) 2500 pcs / tape & reel to-252(dpak) MTN2N65J3 bv dss : 650v r dson( typ): 6.2 i d : 1.8a g d s g gate d drain s source environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t3 : 2500 pc s / tape & reel, 13? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 2/11 MTN2N65J3 cystek product specification absolute maximum ratings (t c =25 c) parameter symbol limits unit drain-source voltage v ds 650 v gate-source voltage v gs 30 v continuous drain current i d 1.8 a continuous drain current @t c =100c i d 1.08 a pulsed drain current @ v gs =10v (note 1) i dm 7.2 a single pulse avalanche energy (note 2) e as 8.8 mj avalanche current (note 1) i ar 1.8 a repetitive avalanche energy (note 1) e ar 4.4 mj peak diode recovery dv/dt (note 3) dv/dt 4.5 v/ns maximum temperature for solder ing @ lead at 0.125 in(0.318mm) from case for 10 seconds t l 300 c total power dissipation (t a =25 ) 1.14 w w total power dissipation (t c =25 ) linear derating factor p d 44 0.35 w/ c operating junction and storage temperature tj, tstg -55~+150 c note : 1 . repetitive rating; pulse width limited by maximum junction temperature. 2 . i as =1.8a, v dd =50v, l=5mh, r g =25 , starting t j =+25 . 3 . i sd 1.8a, di/dt 100a/ s, v dd bv dss , starting t j =+25 . thermal data parameter symbol value unit thermal resistance, junction-to-case, max r th,j-c 2.87 c/w thermal resistance, junction-to-ambient, max r th,j-a 110 c/w
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 3/11 MTN2N65J3 cystek product specification characteristics (t c =25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss 650 - - v v gs =0, i d =250 a, tj=25 ? bv dss / ? tj - 0.6 - v/ c reference to 25c, i d =250 a v gs(th) 2.0 - 4.0 v v ds = v gs , i d =250 a *g fs - 1 - s v ds =15v, i d =0.9a na i gss - - 100 v gs = 30 - - 1 a v ds =650v, v gs =0 i dss - - 10 a v ds =520v, v gs =0, t c =125 c *r ds(on) - 6.2 7 v gs =10v, i d =0.9a dynamic *qg - 8.5 11 *qgs - 2 - *qgd - 4 - nc i d =1.8a, v dd =520v, v gs =10v *t d(on) - 15 30 *tr - 40 80 *t d(off) - 40 80 v dd =325v, i d =1.8a, v gs =10v, ns r g =25 , r d =180 *t f - 30 60 ciss - 260 340 coss - 25 33 crss - 5.5 7 pf v gs =0v, v ds =25v, f=1mhz source-drain diode *v sd - - 1.5 v i s =1.8a, v gs =0v *i s - - 1.8 *i sm - - 7.2 a *trr - 220 - ns v gs =0, i f =1.8a, di/dt=100a/ s *qrr - 1.1 - c *pulse test : pulse width 300 s, duty cycle 2% recommended soldering footprint
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 4/11 MTN2N65J3 cystek product specification typical characteristics typical output characteristics 0 1 2 3 4 0 102030405060 drain-source voltage -vds(v) drain current - id(a) vgs=4.5v 15v 10v 9v 7v 6v 5v 5.5v static drain-source on-resistance vs ambient temperature 3 5 7 9 11 13 15 -100 -50 0 50 100 150 ambient temperature-ta(c) static drain-source on-state resistance-rds(on)() id=0.9a, vgs=10v drain current vs gate-source voltage 0 0.5 1 1.5 2 0 5 10 15 20 gate-source voltage-vgs(v) drain current-id(on)(a) ta=25c vds=10v static drain-source on-state resistance vs drain current 5 10 15 0.1 1 10 drain current-id(a) static drain-source on-state resistance-rds(on)() vgs=10v static drain-source on-state resistance vs gate-source voltage 5 10 15 20 024681012 gate-source voltage-vgs(v) static drain-source on-state resistance-rds(on)() id=0.9a ta=25c forward drain current vs source-drain voltage 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 source drain voltage -vsd(v) forward current-if(a) vgs=0v ta=25c ta=150c
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 5/11 MTN2N65J3 cystek product specification typical characteristics(cont.) capacitance vs reverse voltage 1 10 100 1000 0 5 10 15 20 25 30 drain-to-source voltage-vds(v) capacitance-(pf) ciss coss crss f=1mhz brekdown voltage vs ambient temperature 600 650 700 750 800 850 -100 -50 0 50 100 150 200 ambient temperature-tj(c) drain-source breakdown voltage bvdss(v) id=250a, vgs=0v gate charge characteristics 0 2 4 6 8 10 12 0246810 total gate charge---qg(nc) gate-source voltage---vgs(v) id=1.8a vds=130v vds=325v vds=520v maximum safe operating area 0.01 0.1 1 10 1 10 100 1000 drain-source voltage -vds(v) drain current --- id(a) o p eration in this area is limited by rds(on) dc 10ms 100ms 1m s 100 s 10 s maximum drain current vs case temperature 0 0.5 1 1.5 2 2.5 25 50 75 100 125 150 175 case temperature---tc(c) maximum drain current---id(a)
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 6/11 MTN2N65J3 cystek product specification typical characteristics(cont.) transient thermal response curves 0.01 0.1 1 10 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 t 1 , square wave pulse duration(s) z jc (t), thermal response single pulse 0.01 0.02 0.05 0.1 0.2 d=0.5 1.z jc (t)=2.87 c/w max. 2.duty factor, d=t 1 /t 2 3.t jm -t c =p dm *z jc (t)
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 7/11 MTN2N65J3 cystek product specification test circuits and waveforms
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 8/11 MTN2N65J3 cystek product specification test circuits and waveforms(cont.)
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 9/11 MTN2N65J3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 10/11 MTN2N65J3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow pb-free assembly profile feature sn-pb eutectic assembly average ramp-up rate 3 c/second max. 3 c/second max. (tsmax to tp) preheat 100 c 150 c ? temperature min(t s min) ? temperature max(t s max) 150 c 200 c ? time(ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: ? temperature (t l ) 183 c 217 c ? time (t l ) 60-150 seconds 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak 10-30 seconds 20-40 seconds temperature(tp) ramp down rate 6 c/second max. 6 c/second max. 6 minutes max. 8 minutes max. time 25 c to peak temperature note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c722j3 issued date : 2010.08.06 revised date : 2013.12.26 page no. : 11/11 MTN2N65J3 cystek product specification to-252 dimension marking: style: pin 1.gate 2.drain 3.source 4.drain 3-lead to-252 plastic surface mount package cystek package code: j3 device name date code cys 2n65 1 2 3 4 inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 a1 0.000 0.005 0.000 0.127 e1 0.172 0.188 4.372 4.772 b 0.039 0.048 0.990 1.210 h 0.163 ref 4.140 ref b 0.026 0.034 0.660 0.860 k 0.190 ref 4.830 ref b1 0.026 0.034 0.660 0.860 l 0.386 0.409 9.800 10.400 c 0.018 0.023 0.460 0.580 l1 0.114 ref 2.900 ref c1 0.018 0.023 0.460 0.580 l2 0.055 0.067 1.400 1.700 d 0.256 0.264 6.500 6.700 l3 0.024 0.039 0.600 1.000 d1 0.201 0.215 5.100 5.460 p 0.026 ref 0.650 ref e 0.236 0.244 6.000 6.200 v 0.211 ref 5.350 ref notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead : pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .

▲Up To Search▲

Price & Availability of MTN2N65J3

	To Download MTN2N65J3 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .